Friday, February 12, 2016

Qualcomm Snapdragon 625, 435 and 425 announced


Qualcomm today introduced three new SoCs – Snapdragon 625, Snapdragon 435 and Snapdragon 425. The Snapdragon 625 is an Octa-Core SoC, which is first in its class of Snapdragon processors to use 14 nm FinFET technology. It also has an integrated X9 LTE modem.



Snapdragon 625 (MSM8953) SoC

4K HEVC camcorder and 24-megapixel camera (including 13MP selfies) with amazing image quality for the 600 series. And if gaming and “pwnage” is more your style, you’ll get more playing time, not to mention the superior graphics of the advanced Qualcomm Adreno 506 GPU. In short, whatever you do with your smartphone, the Snapdragon 625 is engineered to let you do more of it.

  • 2GHz x 8 ARM Cortex A53 CPUs
  • 14nm LPP FinFET process technology
  • 933MHz LPDDR3 memory, eMMC 5.1, SD 3.0 (SDCC)
  • Qualcomm Adreno 506 GPU, OpenGL ES 3.1+
  • Integrated X9 LTE, with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
  • Cat 7 speeds of up to 300 Mbps down/150 Mbps up via 2×20 MHz carrier aggregation in the downlink and uplink on LTE FDD and LTE TDD
  • up to 1080p display, 1900×1200 60fps UI
  • Up to 24 MP camera Dual Image Sensor Processor (ISP)
  • Up to 4K capture and playback, H.264 (AVC), H.265 (HEVC)
  • Up to 802.11ac with MU-MIMO, Qualcomm IZat Gen8C, NFC, USB 3.0 Bluetooth 4.1
  • Fluence noise cancellation technology
  • Qualcomm Quick Charge 3.0

Qualcomm Snapdragon 435 (MSM8940) SoC


  • 1.4GHz x 8 ARM Cortex A53 CPUs
  • 28nm LP process technology
  • 800MHz LPDDR3 memory, eMMC 5.1, SD 3.0 (SDCC)
  • Qualcomm Adreno 505 GPU, OpenGL ES 3.1+
  • Integrated X8 LTE, with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
  • Cat 7 speeds of up to 300 Mbps down/100 Mbps up via 2×20 MHz carrier aggregation in the downlink and uplink on LTE FDD and LTE TDD
  • up to 1080p display, Up to 1080p 60 fps UI
  • Up to 21 MP camera Dual Image Sensor Processor (ISP)
  • Up to 1080p capture and playback, H.264 (AVC), H.265 (HEVC)
  • Up to 802.11ac with MU-MIMO, Qualcomm IZat Gen8C, NFC, USB 2.0 Bluetooth 4.1
  • Fluence noise cancellation technology
  • Qualcomm Quick Charge 3.0


Qualcomm Snapdragon 425 (MSM8917) SoC

Snapdragon 425 redefines the entry-point of the mid-tier, offering solid upgrades in features and experiences over the Snapdragon 410 and 412. The Snapdragon 425 is engineered to support faster connections with the X6 LTE modem; it also supports longer battery life by adding a dedicated Hexagon DSP for both multimedia and sensor processing. For advanced camera use cases, you’ll have a dual ISP, supporting high-resolution images up to 16MP.


  • 1.4GHz x 4 ARM Cortex A53 CPUs
  • 28nm LP process technology
  • 667MHz LPDDR3 memory, eMMC 5.1
  • Qualcomm Adreno 308 GPU, OpenGL ES 3.0
  • Integrated X6 LTE, with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
  • Cat 7 speeds of up to 300 Mbps down/100 Mbps up via 2×20 MHz carrier aggregation in the downlink and uplink on LTE FDD and LTE TDD
  • up to 720p display, Up to 1280×800 60 fps UI
  • Up to 16 MP camera Dual Image Sensor Processor (ISP)
  • Up to 1080p capture and playback, H.264 (AVC), H.265 (HEVC)
  • Up to 802.11ac with MU-MIMO, Qualcomm IZat Gen8C, NFC, USB 2.0 Bluetooth 4.1
  • Fluence noise cancellation technology
  • Qualcomm Quick Charge 2.0

These next-generation Snapdragon 625, Snapdragon 435 and Snapdragon 425 processors are expected to be sampling in mid-2016 and are expected in commercial devices in the second half of this year.




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